Deposition

Intermolecular High-Throughput Experimentation uses state-of-the art deposition equipment and thin film metrology to meet the materials needs of our customers in semiconductors, displays, glass and coatings and other industries.

Physical vapor deposition (PVD) and atomic layer deposition (ALD) deposition methods are primarily used to perform the experiments needed to rapidly analyze materials.

Multiple PVD and ALD equipment can be combined for in-situ development and annealing enabling deposition to be carried without vacuum break.

Example: Configuration including two PVD chambers and two ALD chambers and in-situ anneal.